By Chuan Seng Tan,Kuan-Neng Chen,Steven J. Koester
Three-dimensional (3D) integration is pointed out as a potential road for non-stop functionality progress in built-in circuits (IC) because the traditional scaling method is confronted with extraordinary demanding situations in primary and financial limits. Wafer point 3D IC can take a number of types, and so they often comprise a stack of numerous thinned IC layers which are vertically bonded and interconnected through via silicon through TSV.
There is an extended string of advantages that you'll be able to derive from 3D IC implementation comparable to shape issue, density multiplication, more desirable hold up and tool, better bandwidth, and heterogeneous integration. This e-book offers contributions through key researchers during this box, protecting motivations, know-how structures, functions, and different layout concerns.
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